Hong Kong made a new go-to as global tech gateway
A new platform connects 5,000+ entities across 17 countries for tech ventures.
Hong Kong Science and Technology Parks Corporation (HKSTP) unveiled the Global Connect – Global Innovation Exchange (GIE) in March 2026, positioning it as a year-round platform to help tech ventures scale across borders. The initiative targets over 5,000 entities in its network, including innovators, investors, corporates, chambers, and consulates from 17 countries, with consuls-general attending the opening ceremony. HKSTP CEO Terry Wong described GIE as a structured platform to bring together international networks and innovation communities for collective growth, moving beyond occasional exchanges.
GIE offers programs like Soft Landing, a subsidized virtual testing field for local market groundwork, and market-focused activities such as networking events, success-story sessions, and partnership discussions. Initial focus markets include the UK, France, and Germany from April to June 2026. Pheona Kan, director of new ventures at HKSTP, noted that start-ups need capital, business wins, and scaling resources, and GIE provides matchmaking, launchpad support, and mentorship. The platform complements HKSTP's physical sites in Hong Kong and its Shenzhen branch, aiming to ease access to large corporates and government bodies. Dutch Consul-General Maurits ter Kuile highlighted Hong Kong's appeal for companies exploring the Chinese market due to language, regulations, and taxes.
- HKSTP's Global Connect GIE connects over 5,000 entities from 17 countries, including consulates and corporates.
- Offers Soft Landing testing fields and market-focused networking events for scale-ups in Hong Kong, GBA, and overseas.
- Initial markets include UK, France, and Germany from April to June 2026, with matchmaking and mentorship support.
Why It Matters
GIE provides a structured, trusted route for tech ventures to access capital and partners globally, boosting cross-border scaling.